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Sponsored Links ASML says Samsung invests in its latest chip technology Tweet Share this Email Print Related News Samsung shares drop $12 billion after Apple's court victory 4:02am EDT ASML says Samsung joins Intel to invest in latest chip technology 2:39am EDT Apple triumphs over Samsung in landmark patent case Fri, Aug 24 2012 Apple triumphs over Samsung, awarded over $1 billion damages Fri, Aug 24 2012 Seoul court rules Samsung didn't violate Apple design Fri, Aug 24 2012 Related Topics Tech » An outdoor billboard advertising Samsung Electronics is seen in Seoul August 27, 2012. Credit: Reuters/Lee Jae-Won AMSTERDAM | Mon Aug 27, 2012 3:25am EDT AMSTERDAM (Reuters) - ASML, the world's top chip equipment maker, said Samsung Electronics would invest 779 million euros ($975 million) in its research into costly next-generation chipmaking technology and in buying a 3 percent equity stake. ASML, based in the Netherlands, has already signed up Intel Corp and TSMC in recent weeks with similar deals to fund and fast-track its research. ASML's co-investment program is intended to tie in customers and speed up the development of new technology that will eventually lead to much cheaper gadgets, such as smartphones and tablet computers, and cement its position as the market leader ahead of Nikon. Intel said in July it would spend more than $4 billion to buy up to 15 percent of ASML and fund its research. Within weeks, TSMC signed up as well, agreeing to invest 276 million euros in research over the next five years and to pay 838 million euros for a 5 percent equity stake. Samsung has agreed to similar terms and will invest 276 million euros in research and pay a further 503 million for a 3 percent equity stake in ASML. As customers, the three groups stand to benefit by speeding up the adoption of the next generation of chip manufacturing processes from ASML by as much as two years. There are two areas that ASML wants to fast-track. One is the move to a new chip-making standard based on bigger wafers, as more chips can be produced if the diameter of the wafers is increased to 450 millimeters from 300 mm, leading to significant cost savings. The other concerns an advanced chip-making technique known as extreme ultraviolet or EUV lithography, referring to the light source used in the lithography machines to make tinier but more powerful semiconductors. Intel and other chipmakers are grappling with slowing demand as consumers shift to mobile devices, and economic growth in Europe and even emerging markets is weakening. ($1 = 0.7989 euros) (Reporting by Gilbert Kreijger; Editing by Sara Webb and David Holmes) Tech Related Quotes and News Company Price Related News Tweet this Link this Share this Digg this Email Reprints We welcome comments that advance the story through relevant opinion, anecdotes, links and data. If you see a comment that you believe is irrelevant or inappropriate, you can flag it to our editors by using the report abuse links. Views expressed in the comments do not represent those of Reuters. For more information on our comment policy, see http://blogs.reuters.com/fulldisclosure/2010/09/27/toward-a-more-thoughtful-conversation-on-stories/ Comments (0) Be the first to comment on reuters.com. Add yours using the box above. 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